ADSP-21369 Package Change: Significant Differences in Signal Processing Solutions
"Explore the package change details for ADSP-21369, a high-performance signal processing solution leader. Compare the current SBGA package with the new Flip-Chip BGA design, noting the significant difference in package thickness. Gain insights into the transition and implications of this change in August 2017."
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The World Leader in High Performance Signal Processing Solutions ADSP-21369 Package Change PCN# 17_0163 August 2017
Significant Differences Package thickness: Current Pkg.: 1.70mm max. New Package: 2.84mm max.
