Novel Clean Assembly Techniques and In-Situ Mitigation Processes at TTC2023 Fermilab
Explore innovative clean assembly techniques, in-situ mitigation strategies, and recovery processes at the TTC2023 Fermilab event, focusing on preventing dust particle contaminations, maintaining on-line performance, understanding field emissions, and mitigating contaminations in cavities and cryomodules using robotics, diagnostics, and in-situ cleaning methods. Sessions feature presentations and discussions on these topics.
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WG-3:Novel clean assembly techniques, in-situ mitigation, and recovery processes Conveners: Naruhiko Sakamoto (RIKEN), Martina Martinello (SLAC), Enrico Cenni (CEA) TTC2023 Fermilab Dec. 5 -8
WG-3 Objectives 1. Novel clean assembly techniques including robotics and semi-automated procedures to prevent dust particle contaminations and migrations. 2. Methods to carefully install clean cryomodules into existing dirty facilities or techniques to reduce particulate migration to maintain on-line performance. 3. Diagnostics of field emission to understand where and how field emission is occurring. 4. Off-line techniques like high pressure rinsing to mitigate field emission in various types of cavities and cryomodules. 5. In situ cleaning techniques like pulsed RF conditioning, plasma processing, and helium processing. TTC2023 Fermilab Dec. 5-8
WG-3 Sessions 10/14 minutes presentation with quick questions Comprehensive discussion follows at the end of each sessions TTC2023 Fermilab Dec. 5-8
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