Insights from CEDA Publications: Submission Trends and Processing Times (66 characters)

Discover the latest trends in submission statistics and processing times based on the data from CEDA Publications and IEEE ESL Update. Learn about the editorial board composition, geographical distribution, and recent increases in accepted submissions. Stay informed about the target processing time and changes observed from 2019 to 2023. (366 characters)

• Publications
• Submission Trends
• CEDA
• Processing Times
• Editorial Board (Maximum 4 words per tag
• 22 characters maximum per tag)

booker Follow

Uploaded on Apr 02, 2024 | 0 Views

Download Presentation

Please find below an Image/Link to download the presentation.

The content on the website is provided AS IS for your information and personal use only. It may not be sold, licensed, or shared on other websites without obtaining consent from the author. Download presentation by click this link. If you encounter any issues during the download, it is possible that the publisher has removed the file from their server.

Presentation Transcript

1. CEDA Publications J rg Henkel, VP Publications J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

2. IEEE ESL Update EiC: Preeti Panda J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

3. Editorial Board Composition (2022-23) Editor-in-Chief Preeti Ranjan Panda, IIT Delhi Associate Editors Hiroyuki Tomiyama Ritsumeikan Univ New York Univ Univ of Waterloo Deputy Editor-in-Chief Aviral Shrivastava, Arizona State University ESL Editorial Board Geographical Distribution Ramesh Karri Catherine Gebotys Priyadarshini Panda Yale Univ Partha S. Roop Univ of Auckland Ganapati Bhat Washington State Univ Donatella Sciuto Politecnico Di Milano Debayan Roy Huawei Jingtong Hu Univ of Pittsburgh Ruben Salvador CentraleSupelec Swaroop Ghosh Penn State Univ Rasit Topaloglu IBM Namita Sharma Intel Takuya Azumi Saitama Univ Annelie Heuser CNRS Jingwen Leng Shanghai Jiaotong Univ Amit Singh Univ of Essex Akash Kumar TU Dresden Ozgur Sinanoglu NYU Abu Dhabi Luciana De Micco UNMDP Mirjana Stojilovic EPFL Partha Pratim Pande Washington State Univ Francesca Palumbo Univ of Sassari Reiley Jeyapaul ARM USA: 26% Europe+: 29% Asia/Pac: 29% LatAm: 6% Mengying Zhao Shandong Univ Srinivas Katkoori Univ of South Florida Dip Goswami Eindhoven Univ of Tech Aritra Hazra IIT Kharagpur Male: 76% Female: 24% Alfredo Arnaud Univ Cat lica del Uruguay Soontae Kim KAIST Anupam Chattopadhyay Nanyang Tech. Univ John Jose IIT Guwahati Academic: 85% Industry: 12% Govt. Lab: 3% J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

4. Submission Statistics (2019-23) Original Submissions: 149 (2023 Jan-June) [2022: 283] [2021: 190] [2020: 184] [2019: 152] Recent increase because of Latin America Special Issue Accepted: 26 (2023 Jan-June) [2022: 69] [2021: 40] [2020: 49] [2019: 39] J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

5. Processing Times [2019-23] Processing times trending downwards Quarterly Avg/Median Submission to 1stDecision Range: 3.6-6.4 weeks over 2021-23 Online post times were increasing (but now corrected with additional pages) Target processing time: Aim to reach 3 weeks 20 18 16 14 12 10 8 6 4 2 0 2019 Q1 2019 Q2 2019 Q3 2019 Q4 2020 Q1 2020 Q2 2020 Q3 2020 Q4 2021 Q1 2021 Q2 2021 Q3 2021 Q4 2022 Q1 2022 Q2 2022 Q3 2022 Q4 2023 Q1 A. Average Weeks Submitted to First Decision B. Average Weeks Submitted to Online Post C. Median Weeks Submitted to First Decision D. Median Weeks Submitted to Online Post J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

6. ESL Video Preview Feature All accepted papers accompanied by 3-minute video preview Reviewed by AE Hosted at IEEE Xplore 2022 onwards all published papers have the video preview thumbnail in IEEE Xplore listing Also posting Video Previews on LinkedIn Attract new readers and drive interest Video Thumbnail IEEE Xplore Listing J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

7. PRAC Review in Feb 2023 Very positive feedback Increased submissions Video preview feature Diversity Submissions (geographical). Strong participation from Latin America [Ref: Slide 3] Editorial Board (geographical, gender) [Ref: Slide 2] Question raised: switch to monthly frequency? Maybe when we reach ~90 papers/year (7-8 papers per issue) J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

8. Special Issues Special Issue on Trends in Embedded Mechatronic Systems for Smart Manufacturing Completed 2021, Status: Published Guest Editors: Muhammad Attique Khan (HITEC University, Pakistan), Ammar Armghan (Jouf University, KSA), Seifedine Kadry (NoroffUniversity College, Norway) Special Issues on Latest Advances in Embedded Systems Research in Latin America Completed 2022, Status: Published Completed 2023, Status: Early Access Guest Editors 2023: Maximiliano Antonelli (UNMDP, Argentina), Maria Liz Crespo (ICTP, Italy), Luciana De Micco (UNMDP, Argentina), Carlos Meza Benavides (Hochschule Anhalt and Inst.Tecnol gico de Costa Rica), Rosa Maria Woo Garcia (Universidad Veracruzana, Mexico) Approved for 2024 also 15 Special Issue Proposals submitted in 2023 alone so far Evaluated by team of senior AEs, led by Deputy-EIC (Aviral Shrivastava) J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

9. Conference/Workshop Tie-ups NEW: Embedded Systems Week (ESWEEK) Accepted Late Breaking submissions (4 page) to appear in ESL Argentine Conference on Embedded Systems (CASE) Accepted papers appear as Special Issues (Completed for 2022, 2023. Annual feature now.) NEW: Secure Hardware, Architectures, and Operating Systems (SeHAS) Accepted ESL papers in Embedded Systems Security area to be invited for presentation at SeHAS J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

10. IEEE D&T Update EiC: Partha Pande J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

11. About the Journal About the Journal 6 issues published per year under the co-sponsorship of IEEE Council on Electronic Design Automation, IEEE Test Technology Technical Council, IEEE Circuits and Systems Society, and IEEE Solid-State Circuits Society About The Magazine: Methods and tools used to design and test electronic systems Wide range of scale from devices and circuits to complete systems and embedded software Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy Format includes articles, columns, interviews and roundtable discussions J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

12. Journal Leadership Editor-in-Chief: Partha Pratim Pande School of Electrical Engineering & Computer Science Washington State University, Pullman, WA USA Email: pande@wsu.edu Associate Editor-in-Chief Mehdi Tahoori Karlsruhe Institute of Technology (KIT), Germany Email: mehdi.tahoori@kit.edu Associate Editors Keynotes Analog, Asynchronous and Mixed Signal Deep-Submicron Design, DFM, and Yield Embedded Software Emerging Technologies and Devices Interconnect Low Power Systems Memories Multicores Physical Design Reliability Real-Time and Mixed Criticality Security and Trust Self-Aware and Adaptive Systems SoC and 3D Test and Verification Techniques Things and Systems of Systems J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

13. Design and Test Magazine Magazine Issues in 2023 Jan/Feb: Special issue (SI) on Machine Learning (ML) for CAD / EDA; 8 SI papers, 2 general interest papers. Mar/Apr: Special issue (SI) on Testability and Dependability of AI Hardware; 7 SI papers, 4general interest papers May/June: Special issue (SI) on Approximate Computing: Challenges, Methodologies, Algorithms, and Architectures for Dependable and Secure Systems; 4 SI papers, s general interest papers, interview with Prof. Steve Kang Jul/Aug: SI on 2022 VLSI Test Symposium; 6 SI papers, 2 general interest papers Sept/Oct: SI on SBCCI 22; 5 SI papers, 5 general interest papers and 1 keynote paper Nov/Dec: NOCS 23 (Network-on-Chips), journal first publication mode. J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

14. Design and Test Magazine New Special Issues in Development Post-Quantum Cryptography for Internet-of-Things (IoT) Silicon Lifecycle Management (SLM) 2022 HW-Security Top Picks Approximate Test Ethics in computing Top picks on Test Wearable IoT Devices for Reliable Mobile Health Applications J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

15. Tutorials and Interviews in D&T: The Future Plans Future Tutorial Articles (Tentative) Sayeef Salahuddin et al., Design with Post-10nm CMOS: Challenges and Solutions , UC Berkeley, [Invitation planned] David Pan, AI for Automated Design: Current Practice and Future Promises , UT Austin, [Invitation Planned] Guru Prasadh Venkataramani, Jason Fung, Timing Side-channel Attacks: Spectre, Meltdown and Beyond , George Washington University and Intel Corporation, [Invitation Planned] Shobha Vasudevan and Debjit Pal, Assertion based Verification , Goggle Brain and UIUC, UIC [Invitation Planned] Sandip Ray, Automotive safety and security , U. of Florida Zhiru Zhang et al., AI Acceleration in FPGA, CPU and GPU , Cornell U. Interviews (Nicola Nicolici, McMaster University Canada) Janet Olson, Cadence Steve Kang, UCSC J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

16. IEEE Design and Test Video Roundtables D&T Lead: Ramesh Karri, NYU A series of quarterly events as D&T zoom-based video roundtables with a focus on making it lively. Share IEEE D&T roundtable videos via IEEE D&T website Each D&T roundtable may include 3 visionaries + moderator. 1- 2 visionaries from industry; 1-2 from academia; last for 60 minutes. Q&A type format Sample topics: Test vs Trust (Rob Aitken, Serge Leef, M. Tehranipoor and S. Mitra; Moderator Ramesh; ML for EDA; Moderator Y. Chen or Hai Li. Resurgence of High-Level Design Paradigms: Moderator Luca Carloni; HLS leads from Cadence, Synopsys and Mentor, Jason Cong UCLA J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

17. D&T Highlights Year Papers Submitted Papers Published Pages Downloads Pub/Rank 2018 168 88 604 48353 176 2019 180 71 544 67414 176 2020 266 87 696 57442 178 2021 177 73 712 59290 170 2022 156 99 748 69757 173 2023 108 51 406 37549 275 Pages published per year (2018-2020) Immediacy Index Citation Half-Life Article Influence Impact Factor Eigenfactor 2.223 0.459 8.7 years 0.00149 0.669 Average of 660 Source: IEEE PRAC review of D&T Magazine, 2021 and IEEE updated data February 15, 2023 J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

18. IEEE TCAD Update EiC: David Atienza, J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

19. 1.5 Years of Service At A Glance (1/2) Completed changes in members and review process Editorial board significantly renewed (36 new AEs out of 61) Looking into expand it with new AEs with industrial affiliation (as main affiliation) Improved feedback to authors (6 complaints in 2022-23) 1. Optimized TCAD review process and publication timeline with IEEE HQ Automated steps based on AE recommendations (e.g., automated invitations or auto- decline processes), and desk-reject policy of IEEE fully implemented Reduced backlog and publication delay: from 12 months to 9 months 2. New IEEE TCAD Donald O. Pederson Best Paper Award process implemented 3-step process implemented: allow self-nomination and auto-nominations (impact analysis on-line in the last two years since publication) Revised final selection committee (to be updated again next year: 30% rotation) 3. J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

20. 1.5 Years of Service At A Glance (2/2) Consolidating acceptance rates, submission statistics (Jan 1stto June 30th, 2023) Increase of 22% in number of submissions (mainly from Asia) vs. same period in 2022 Manuscripts Received YTD: 685: 425 original, 260 revised Average decision time (1strevision): 58.57 days Average final decision time: 66.30 days in first half of 2023 Accept Ratio: YTD is 38%, was 40.5% in 2022, 2021 was 46.9% Oldest manuscript without decision: 137 days (it was 203 days in 2021) 3. Successful IEEE PRAC Review (thanks Joerg and Miguel!), feedback addressed Acknowledged relevance and good processed of TCAD to IEEE Acknowledged improved TCAD editorial process efficiency and reduced backlog. Revise TCAD community for the future (danger with current due to new IEEE publications!) 4. J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

21. Points to Discuss (1/2) Editorial board in continuous renewal (last 18 months: 36 new AEs out of 61) Need to: increase diversity (Region 10 Asia and Pacific) and more industrial affiliated AEs. Editors-at-Large renewed - 50% women (3 new members needed out of 6 US-based) Evolution on the number of submissions and scope Heavy load on Editorial Board due to increase in number of submissions Very hard to get expert reviewers, list is decreasing and existing ones not responding Continuous pressure on backlog: additional new pages requested for 2023 J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

22. Points to Discuss (2/2) Concerns on number of nominations nominations for new IEEE TCAD Donald O. Pederson Best Paper Award Authors-based and AE-nominated papers in Manuscript Central very small pool (5 in 2022) EiC added auto-nominated papers based on multiple criteria: Little diversity in topics and regions (e.g., US-based papers, and in AI-related almost all of them). Final selection committee: Editors-at-Large, updated this year (30% rotation / two years) New/joint topics have been consolidated and traditional ones are evolving Popular topics: CPS and IoT , Automation for Emerging Tech. / Emerging Tech. (Quantum), Machine Learning/AI Automation Out of scope papers: Analog & Mixed signed -> new designs (circuits) instead of tools (software) PRAC asked CEDA to identify new topics (Possible danger with new IEEE Journals!) J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco

23. Ideas for Next Steps Continue reducing TCAD backlog and editorial board processes Keep reducing TCAD backlog: complex to with current submission increase! Delays in review process without delays: key concern on diminishing pool of reviewers! Shall we go for open review culture (as in AI community)? Expand list of possible AE candidates (particulary in Asia and with industrial affiliation) Opportunities/challenges for significant improvements Keep controlling outliers (unsuitable submissions in review pipeline: fast decision of resubmit to other journal ) Danger with IEEE Journals taking over TCAD scope: IEEE Transactions on Circuits and Systems for Artificial Intelligence (TCASAI) approx. 35% papers of TCAD Stronger links with top conferences within TCAD's core technical areas : Follow example of ESWEEK with ICCAD or others (publish their top articles directly -> already complete ideas). J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco J. Henkel, CEDA BOG, July 9th. 2023, San Fancisco