Qualcomm chipset - PowerPoint PPT Presentation


Rescue Drone: Increasing Autonomy and Implementing Computer Vision

Focuses on developing a rescue drone with increased autonomy and implementing computer vision for advanced object detection. The team, consisting of Cody Campbell (Hardware Engineer), Alexandra Borgesen (Computer Engineer), Halil Yonter (Team Leader), Shawn Cho (Software Engineer), Peter Burchell (M

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Azure IoT Edge

Seamlessly move cloud and custom workloads to the edge securely. Deploy AI and advanced analytics with ease. Monitor and update from the cloud. Azure IoT Edge provides a secure and scalable solution from chipset to the cloud.

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High-Level Thoughts on Distributed Tone Resource Unit (dRU) Design in IEEE 802.11-23/1988r2 November 2023

Various aspects of Distributed Tone Resource Unit (dRU) design in IEEE 802.11-23/1988r2, such as PSD limitations, distributed transmission regulations, application areas, and open questions are discussed in this presentation by Lin Yang from Qualcomm. Topics include tone distribution, power pooling

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IEEE 802.11-23-1689r1 Vice Chair Report - November 2023 Plenary Session

The document presents the Vice Chair report by Jon Rosdahl from Qualcomm at the IEEE 802.11-23-1689r1 meeting in Honolulu on November 17, 2023. It covers agenda items, session information, meeting logistics, successful meeting protocols, and important event summaries. Additionally, it provides detai

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IEEE 802.11-21/1321r1 WLAN Sensing Procedure Proposal

This document by Solomon Trainin from Qualcomm presents a proposal on aligning the SFD for the WLAN sensing procedure. It aims to resolve contradictions, optimize behavior, and introduce a structured WLAN sensing procedure. The content outlines phases, terminology, setup, measurement, and reporting

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Highlights from 3GPP TSG-RAN WG4 Meeting #97-e - November 2020

Various companies presented contributions for AMPR and REFSENS for 35MHz and 45MHz channel bandwidths at the electronic meeting of 3GPP TSG-RAN WG4. Discussions included agreements, issues related to n8, n25, and n71 45MHz REFSENS, UL configurations for different regions and carriers, A-MPR agreemen

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OAI 5G CN Workshop Fall 2021 Overview

Fall 2021 OpenAirInterface Workshop focused on developing a 5G Core Network stack, featuring sessions on 5GC basic procedures, different 5GC modes, deployment strategies, and roadmap discussions. The workshop agenda included labs on deploying the OAI Core Network, using VPP-based UPF, network slicin

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Analysis of Conglomerate Mergers and Competition Concerns in Recent Cases

The analysis delves into the increasing trend of conglomerate mergers and potential competition issues in recent cases like Qualcomm/NXP, Luxottica/Essilor, and Bayer/Monsanto. It examines bundling strategies, interoperability challenges, and leveraging of data to understand the impact on market com

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IEEE 802 Plenary Meeting Report - November 2018 in Bangkok

The document provides detailed reports and information from the IEEE 802 Plenary Meeting held in November 2018 in Bangkok. It includes session agendas, meeting logistics, location details, important discussion points, break services, lunch options, and more for the event attended by Jon Rosdahl from

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Economic Outdoor CPE/AP with 300Mbps Transmission - SY205

SY205 is a cost-effective outdoor CPE/AP designed for long-range WiFi coverage, supporting IEEE 802.11b/g/n standards with a 300Mbps data rate. Equipped with a Qualcomm QCA9531 chipset and 14dBi directional antenna, it offers a wireless distance of over 1KM. The device supports various modes, includ

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IEEE 802.11-23-1690r2 November 2023 PAR Review Summary

The document covers the IEEE 802.11-23-1690r2 November 2023 PAR Review Subcommittee meeting agenda, snapshots, and abstract. It includes details on the PARs under consideration for the November Mixed-mode Plenary, meeting times, registration information, and participant behavior guidelines. Jon Rosd

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Performance Aspects of Multi-link Operations in IEEE 802.11-19/1291r0

This document explores the performance aspects, benefits, and assumptions of multi-link operations in IEEE 802.11-19/1291r0. It discusses the motivation for multi-link operation in new wireless devices, potential throughput gains, classification of multi-link capabilities, and operation modes. The s

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IEEE 802.11-19/1759r3 Vice Chair Report Summary

The document presents the IEEE 802.11-19/1759r3 Vice Chair Report for January 2020, delivered by Jon Rosdahl from Qualcomm. It covers agenda items, meeting plans, session locations, registrations, attendance, and other logistical details of the IEEE 802 Wireless Interim Session held in Irvine, Calif

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IEEE 802.11-23-0591r1 1st Vice Chair Report May 2023 Interim Orlando

The May 2023 interim session of IEEE 802.11 was held in Orlando, featuring reports and agenda items presented by Jon Rosdahl of Qualcomm. The sessions covered essential aspects such as meeting logistics, protocols for in-room and remote attendees, and network contacts. The event provided valuable in

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Qualcomm: A Leading Innovator in Mobile Technology

Qualcomm, a pioneer in mobile technology, has a rich history of innovations in CDMA technology and chipset development. From founding in 1985 to present success with Snapdragon processors, Qualcomm's key to success lies in powerful mobile chipsets and CDMA technology. Explore Qualcomm's journey from

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3GPP TSG-RAN4 Meeting #98e - bis E-meeting Overview

Approval document for test cases on MR-DC Idle mode CA measurements by Nokia, Nokia Shanghai Bell. Includes baseline agreements, development details, WF approvals, and test case lists. Also covers MD-DC EMR test cases and measurement performance test cases for SS-RSRP and SS-RSRQ. Discussion summari

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Legacy Test Cases Handling for Qualcomm CDMA Technologies Meeting Summary

Discussion at the meeting focused on adjusting legacy test cases for Vertical features, particularly for SNPN Only UE and RedCap solutions. Consensus was reached on moving forward with proposed changes and revisions to test cases applicable to the mentioned technologies. Various technical correction

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LTE feMob RAN4 Meeting Test Cases Approval Document

Approval document for LTE feMob test cases was discussed in the 3GPP TSG-RAN4 Meeting #97-e. Nokia, Nokia Shanghai Bell, Qualcomm, and Huawei are responsible for various test cases related to intra-band, inter-frequency synchronous, and asynchronous handovers. The meeting also outlined new inter-fre

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Overview of E-Podium Specifications and Components

The E-Podium is equipped with a steel body, touch monitors, a PC with Intel i3 processor, controller, and various electronic components. The display includes a 19" touch monitor and a 10.4" sub-monitor. The PC features a motherboard with Intel H61 chipset, Intel HD2000 graphics, and dual-channel DDR

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IEEE 802 Wireless Meeting Venue Reports and Future Plenary Contracts Update

Jon Rosdahl from Qualcomm provided updates on the current status of 802 Wireless Interim Session venue plans, a recap of 802 Executive Committee decisions, and future 802 Plenary venue contract statuses up to 2027. The presentation highlighted selected venues, open dates, and upcoming contracts for

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Cognitive Passive Estimation of Available Bandwidth in Overlapped IEEE 802.11 WiFi WLANs

Efficient bandwidth estimation is crucial for network management and QoS applications, with cognitive passive methods offering insights without additional traffic loads. This research explores the impact of control messaging overhead, network topology, channel usage, hidden/exposed terminals, and pa

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IEEE 802.11-22/0059r0 Submission for Next Generation MAC/PHY Standards

Submission by Rolf de Vegt from Qualcomm Technologies, Inc. discusses the need for a new mainstream MAC/PHY standard beyond IEEE 802.11be. The document provides insights on market context, potential timelines, and emerging market requirements for future standards development in the Wi-Fi ecosystem.

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IEEE 802.11-15/0880r2 Scheduled Trigger Frames - July 2015

This document from July 2015 discusses the IEEE 802.11-15/0880r2 Scheduled Trigger Frames, featuring various authors from Qualcomm, LG Electronics, Intel, Marvell, Broadcom, and Mediatek. The document includes multiple submission slides with contact information for the authors.

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