Optimizing Class-D PCB Layout for TPA3255 EVM
"Explore effective grounding techniques and layout considerations for high-power Class-D PCBs using TPA3255 EVM. Learn about strong ground paths, power pin coupling, trace overlap, and more."
Uploaded on | 0 Views
Download Presentation
Please find below an Image/Link to download the presentation.
The content on the website is provided AS IS for your information and personal use only. It may not be sold, licensed, or shared on other websites without obtaining consent from the author. Download presentation by click this link. If you encounter any issues during the download, it is possible that the publisher has removed the file from their server.
E N D
Presentation Transcript
High Power Class-D PCB Layout- TPA3255 EVM Strong Ground path from Output side of Board
High Power Class-D PCB Layout- TPA3255 EVM All power Gnd pins are tightly coupled
High Power Class-D PCB Layout- TPA3255 EVM Top and Bottom traces do not overlap Ground plane is not isolated! Top and Bottom Ground pour are inter-connected
High Power Class-D PCB Layout- TPA3255 EVM
