LED Bulb Cooling Simulation with COMSOL
LED Bulb Cooling
COMSOL
Background
Light-emitting diode (LED) bulbs are nowadays preferred to incandescent light bulbs
because of their higher longevity and energy efficiency
In LED bulbs, light is produced by electroluminescence, but 70% of the electrical power
consumed is lost as heat in the process
Geometry and material properties can be optimized during the design process to prevent
the bulb from overheating
Model Definition
The device consists of an
aluminum PCB supporting LED
chips inside a plastic bulb
The inside and outside of the bulb
are filled with air
Symmetries are used on the
two planes of symmetry to reduce
computational time
Model geometry
Model Definition
LED chips are considered as heat
sources dissipating power equal
to the heat losses
The radiative surface-to-ambient
heat transfer is taken into account
on the PCB and LED chips
Buoyancy forces are taken into
account for natural convection
inside and outside the bulb
Model boundary conditions
Model Definition
Model boundary conditions
Free boundaries are defined
around the bulb, with a pressure
constraint on the bottom
boundary to close the problem
Results
The LED chips are cooled by
conduction and convection with
the air inside the bulb, and by
radiation to the ambient air
The air inside the bulb is itself
cooled by conduction with the
plastic bulb in contact with
ambient air
The hot air inside the bulb can
escape through small holes on the
top of the bulb
Temperature field outside the LED bulb
Results
The thin film of hot air around the
bulb creates a vertical airflow due
to buoyancy forces
Convective cells appear inside the
bulb
Velocity field inside and outside the LED bulb
LED bulbs are preferred for their longevity and energy efficiency, but 70% of electrical power is lost as heat. This simulation using COMSOL optimizes the design to prevent overheating by considering heat sources, heat transfer, natural convection, and boundary conditions. Results show efficient cooling mechanisms inside and outside the bulb, maintaining optimal temperature levels.
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Presentation Transcript
LED Bulb Cooling COMSOL
Background Light-emitting diode (LED) bulbs are nowadays preferred to incandescent light bulbs because of their higher longevity and energy efficiency In LED bulbs, light is produced by electroluminescence, but 70% of the electrical power consumed is lost as heat in the process Geometry and material properties can be optimized during the design process to prevent the bulb from overheating
Model Definition The device consists of an aluminum PCB supporting LED chips inside a plastic bulb The inside and outside of the bulb are filled with air Symmetries are used on the two planes of symmetry to reduce computational time Model geometry
Model Definition LED chips are considered as heat sources dissipating power equal to the heat losses The radiative surface-to-ambient heat transfer is taken into account on the PCB and LED chips Buoyancy forces are taken into account for natural convection inside and outside the bulb Model boundary conditions
Model Definition Free boundaries are defined around the bulb, with a pressure constraint on the bottom boundary to close the problem Model boundary conditions
Results The LED chips are cooled by conduction and convection with the air inside the bulb, and by radiation to the ambient air The air inside the bulb is itself cooled by conduction with the plastic bulb in contact with ambient air The hot air inside the bulb can escape through small holes on the top of the bulb Temperature field outside the LED bulb
Results The thin film of hot air around the bulb creates a vertical airflow due to buoyancy forces Convective cells appear inside the bulb Velocity field inside and outside the LED bulb
