Advanced Technologies for Particle Detection and Monitoring

Cutting-edge technology such as HVCMOS RD50-CMOS project along with CaRIBOu and Xilinx ZC706 evaluation board are being employed for precise measurements in E-TCT with passive and active pixel detectors. The development of Radiation Monitor Sensor Boards for ITk, involving sensors like RadFETs and diodes, is crucial for accurate radiation detection. Additional components like readout current sources with customizable features are also being implemented to meet high-dose requirements. Collaborative efforts are underway for upgrades, including ELMB for ADC and DCS in the ATLAS project. The project timeline aims for completion by 2026.

• Particle Detection
• Technology Advancement
• Radiation Monitoring
• Sensor Boards
• Electronics Development

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1. HVCMOS RD50 CMOS project nov ip RD50-MPW2 pride ven julija, 4 upornosti mi bomo merili E-TCT s pasivnimi pixli (diode) dobro bi bilo, e bi lahko brali in merili E-TCT tudi z aktivnimi detektorji (to bi se dalo z RD50-MPW2, ker je ip majhen in je PCB narejen tako, da je ip ob robu) Za branje aktivnih pixlov na RD50-MPW2 bi rabili CaRIBOu dobimo pri UNI Geneva ~1400 CHF Xilinx ZC706 evaluation board ~ 2500 USD A tole nabavimo?

2. Status RADMON za ITk

3. Lokacije radmonov (28) Approximate locations confirmed, to early to specify exact locations: 1) strip barrel outer cylinder, z ~ 0, r ~ 1100 mm, one in each quadrant 2) strip EC volume (r ~ 600 mm, z ~ 1600 mm in each quadrant, on side A and C) fixed on the blades of disk 1 or disk 2 3) endcap side A and C (z > 3000 mm, r ~ 400 mm and r ~ 800 mm, one in each quadrant) at r ~ 800 mm strip PP1 volume, fixed on the outer side of the structural bulkhead at lower r (~ 400 mm ) on the outer side of PP1 (see figure) confirmed confirmed confirmed confirmed 3 I. Mandi , Jo ef Stefan Institute, Ljubljana AUW, April 2019

4. Radiation Monitor Sensor Board (RMSB) make something very similar for the ITk example from ATLAS ID shown on photos connector or pigtail 3 cm x 3 cm, 0.8 cm thick ceramic (Al2O3) hybrid, connected to PCB frame with soldered wires back side covered with resistive layer to heat the ceramics stabilize temperature at 20 C fixed in PEEK support for mechanical protection and air gap for insulation Sensors on ITk RMSB: 3 RadFETs (TID) need to qualify NurFET 3 diodes (NIEL) 1 temperature sensor (10 kOhm NTC) 4

5. Readout Current source: 0.1 and 1 mA current pulses up to 100 V 0.1 s 1 s long ELMB, DAC current sources, temp. stabilization, communication with DCS as in ATLAS ID ELMB DAC goes only up to 30 V 30 V je premalo, da bi li do zadosti visokih doz (1e15 in 100 kGy) partly custom made: combination of ELMB (for ADC, communication with DCS) and fully custom made 5

6. 1 ADC (ELMB?) Switching matrix ATLAS DCS 2 Current source 3 Tele kose naj bi mi naredili Narejeno mora biti nekje do 2026 4 Pri ATLAS je vse delal ELMB Za upgrade je problem, da bi rabili Vi je napetosti kot cca 30 V kar Lahko dobimo iz DAC 28 channel Temperature Control unit 28 in USA15