IEEE 802.11-23/2175r2 TGbn January Interim Meeting Report

The January 2024 document outlines the proceedings of the IEEE 802.11-23/2175r2 TGbn January interim meeting. It covers session schedules, chair elections, technical submissions, goals for March 2024, and the teleconference plan. Additionally, it provides information on the timeline and status of TGbn, including key milestones from PAR approval to final approvals in 2028.

• IEEE
• TGbn
• Interim Meeting
• Technical Submissions
• Timeline

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1. January 2024 doc.: IEEE 802.11-23/2175r2 TGbn January Closing Report Date: 2024-01-18 Authors: Name Alfred Asterjadhi Qualcomm Inc. Affiliations Address Phone +1-858-658-5302 aasterja@qti.qualcomm.com email 5775 Morehouse Drive, San Diego, CA 92121, U.S.A. Submission Slide 1 Alfred Asterjadhi, Qualcomm Inc.

2. January 2024 doc.: IEEE 802.11-23/2175r2 TGbn (Ultra High Reliability) TGbn had scheduled 9 sessions during the January interim Elected 3 chairs for each ad-hoc (MAC/PHY) PHY ad-hoc chairs: Dongguk Lim, Sigurd Schelstraete, Tianyu Wu MAC ad-hoc chairs: Xiaofei Wang, Srinivas Kandala, Jeongki Kim Discussed more than 50 technical submissions Consensus reached on distributed RU and roaming Agenda is available in 11-23/2174r11 Motions are available in 11-24/171r1 Goals for March 2024: Discuss technical submissions Submission Slide 2 Alfred Asterjadhi, Qualcomm Inc.

3. January 2024 doc.: IEEE 802.11-23/2175r2 Teleconference Plan Jan 29 (Monday) MAC/PHY 19:00-21:00 ET - Feb 01 (Thursday) Joint 10:00-12:00 ET - Feb 05 (Monday) MAC/PHY 19:00-21:00 ET - Feb 08 (Thursday) No Conf Call Holiday - Feb 12 (Monday) No Conf Call Holiday - Feb 15 (Thursday) No Conf Call Holiday - Feb 19 (Monday) No Conf Call Holiday - Feb 22 (Thursday) MAC/PHY 10:00-12:00 ET - Feb 26 (Monday) Joint 19:00-21:00 ET - Feb 29 (Thursday) MAC/PHY 10:00-12:00 ET - Mar 04 (Monday) MAC/PHY 19:00-21:00 ET - Mar 07 (Thursday) Joint 10:00-12:00 ET - Submission Slide 3 Alfred Asterjadhi, Qualcomm Inc.

4. January 2024 doc.: IEEE 802.11-23/2175r2 TGbn Timeline And Status PAR approved First TG meeting D0.1 D1.0 Letter Ballot D2.0 LB D3.0 LB Initial SA ballot (D4.0) Final 802.11 WG approval 802 EC approval RevCom and SASB approval July 2023 Nov 2023 Jan 2025 May 2025 May 2026 Jan 2027 May 2027 Mar 2028 Mar 2028 May 2028 Submission Slide 4 Alfred Asterjadhi, Qualcomm Inc.