IEEE 802.11-16/1421r0 Smoothness Recommendation for HE-LTF
This document discusses smoothness recommendations for High-Efficiency Long Training Field (HE-LTF) in the IEEE 802.11 standard. It includes contributions from multiple authors representing various affiliations. The recommendations aim to enhance the performance of wireless communication systems utilizing HE-LTF.
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doc.: IEEE 802.11-16/1421r0 Smoothness Recommendation for HE-LTF Date: 2016-11-xx Authors: Feng Jiang feng1.jiang@intel.com Qinghua Li quinghua.li@intel.com Xiaogang Chen xiaogang.c.chen@intel.com Robert Stacey robert.stacey@intel.com 2111 NE 25th Ave, Hillsboro OR 97124, USA Po-Kai Huang po-kai.huang@intel.com +1-503-724-893 Intel Shahrnaz Azizi shahrnaz.azizi@intel.com Chitto Ghosh chittabrata.ghosh@intel.com Laurent Cariou laurent.cariou@intel.com Yaron Alpert yaron.alpert@intel.com Assaf Gurevitz Ilan Sutskover assaf.gurevitz@intel.com ilan.sutskover@intel.com Submission Slide 1 Feng Jiang, Intel Corporation, et. al.
doc.: IEEE 802.11-16/1421r0 Authors (continued) Name Affiliation Address Phone Email 5775 Morehouse Dr. San Diego, CA, USA Straatweg 66-S Breukelen, 3621 BR Netherlands 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 1700 Technology Drive San Jose, CA 95110, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA USA Straatweg 66-S Breukelen, 3621 BR Netherlands 2100 Lakeside Boulevard Suite 475, Richardson TX 75082, USA 1060 Rincon Circle San Jose CA 95131, USA Straatweg 66-S Breukelen, 3621 BR Netherlands Alice Chen alicel@qti.qualcomm.com Albert Van Zelst allert@qti.qualcomm.com Alfred Asterjadhi aasterja@qti.qualcomm.com Bin Tian btian@qti.qualcomm.com Carlos Aldana caldana@qca.qualcomm.com George Cherian gcherian@qti.qualcomm.com Gwendolyn Barriac gbarriac@qti.qualcomm.com Qualcomm Hemanth Sampath hsampath@qti.qualcomm.com Lin Yang linyang@qti.qualcomm.com Lochan Verma lverma@qti.qualcomm.com Menzo Wentink mwentink@qti.qualcomm.com Naveen Kakani nkakani@qti.qualcomm.com Raja Banerjea rajab@qit.qualcomm.com Richard Van Nee rvannee@qti.qualcomm.com Submission Feng Jiang, Intel Corporation, et. al. Slide 2
doc.: IEEE 802.11-16/1421r0 Authors (continued) Name Affiliation Address Phone Email 1700 Technology Drive San Jose, CA 95110, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 1700 Technology Drive San Jose, CA 95110, USA 1700 Technology Drive San Jose, CA 95110, USA 1700 Technology Drive San Jose, CA 95110, USA Rolf De Vegt rolfv@qca.qualcomm.com Sameer Vermani svverman@qti.qualcomm.com Simone Merlin smerlin@qti.qualcomm.com Qualcomm Tevfik Yucek tyucek@qca.qualcomm.com VK Jones vkjones@qca.qualcomm.com Youhan Kim youhank@qca.qualcomm.com Submission Feng Jiang, Intel Corporation, et. al. Slide 3
doc.: IEEE 802.11-16/1421r0 Authors (continued) Name Affiliation Address Phone Email Hongyuan Zhang hongyuan@marvell.com Yakun Sun yakunsun@marvell.com Lei Wang Leileiw@marvell.com Liwen Chu liwenchu@marvell.com Jinjing Jiang jinjing@marvell.com Yan Zhang yzhang@marvell.com Rui Cao ruicao@marvell.com 5488 Marvell Lane, Santa Clara, CA, 95054 Sudhir Srinivasa Marvell 408-222-2500 sudhirs@marvell.com Bo Yu boyu@marvell.com Saga Tamhane sagar@marvell.com Mao Yu my@marvel..com Xiayu Zheng xzheng@marvell.com Christian Berger crberger@marvell.com Niranjan Grandhe ngrandhe@marvell.com Hui-Ling Lou hlou@marvell.com Submission Feng Jiang, Intel Corporation, et. al. Slide 4
doc.: IEEE 802.11-16/1421r0 Authors (continued) Name Affiliation Address Phone Email 5775 Morehouse Dr. San Diego, CA, USA Straatweg 66-S Breukelen, 3621 BR Netherlands 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 1700 Technology Drive San Jose, CA 95110, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA USA Straatweg 66-S Breukelen, 3621 BR Netherlands 2100 Lakeside Boulevard Suite 475, Richardson TX 75082, USA 1060 Rincon Circle San Jose CA 95131, USA Straatweg 66-S Breukelen, 3621 BR Netherlands Alice Chen alicel@qti.qualcomm.com Albert Van Zelst allert@qti.qualcomm.com Alfred Asterjadhi aasterja@qti.qualcomm.com Bin Tian btian@qti.qualcomm.com Carlos Aldana caldana@qca.qualcomm.com George Cherian gcherian@qti.qualcomm.com Gwendolyn Barriac gbarriac@qti.qualcomm.com Qualcomm Hemanth Sampath hsampath@qti.qualcomm.com Lin Yang linyang@qti.qualcomm.com Lochan Verma lverma@qti.qualcomm.com Menzo Wentink mwentink@qti.qualcomm.com Naveen Kakani nkakani@qti.qualcomm.com Raja Banerjea rajab@qit.qualcomm.com Richard Van Nee rvannee@qti.qualcomm.com Submission Feng Jiang, Intel Corporation, et. al. Slide 5
doc.: IEEE 802.11-16/1421r0 Authors (continued) Name Affiliation Address Phone Email 2860 Junction Ave, San Jose, CA 95134, USA Jianhan Liu +1-408-526-1899 jianhan.Liu@mediatek.com Thomas Pare thomas.pare@mediatek.com chaochun.wang@mediatek.c om james.wang@mediatek.com ChaoChun Wang Mediatek USA James Wang Tianyu Wu tianyu.wu@mediatek.com russell.huang@mediatek.co m Russell Huang No. 1 Dusing 1st Road, Hsinchu, Taiwan James Yee +886-3-567-0766 james.yee@mediatek.com Mediatek Alan Jauh alan.jauh@mediatek.com Frank Hsu frank.hsu@mediatek.com Joonsuk Kim joonsuk@apple.com guoqing_li@apple.com Guoqing Li Jarkko Kneckt Apple jkneckt@apple.com Eric Wong ericwong@apple.com Chris Hartman chartman@apple.com Submission Feng Jiang, Intel Corporation, et. al. Slide 6
doc.: IEEE 802.11-16/1421r0 Authors (continued) Name Affiliation Address Phone Email F1-17, Huawei Base, Bantian, Shenzhen 5B-N8, No.2222 Xinjinqiao Road, Pudong, Shanghai 5B-N8, No.2222 Xinjinqiao Road, Pudong, Shanghai F1-17, Huawei Base, Bantian, Shenzhen 5B-N8, No.2222 Xinjinqiao Road, Pudong, Shanghai 5B-N8, No.2222 Xinjinqiao Road, Pudong, Shanghai 10180 Telesis Court, Suite 365, San Diego, CA 92121 F1-17, Huawei Base, Bantian, Shenzhen F1-17, Huawei Base, Bantian, Shenzhen F1-17, Huawei Base, Bantian, Shenzhen 10180 Telesis Court, Suite 365, San Diego, CA 92121 NA 303 Terry Fox, Suite 400 Kanata, Ottawa, Canada David X. Yang david.yangxun@huawei.com Jiayin Zhang zhangjiayin@huawei.com +86-18601656691 Jun Luo jun.l@huawei.com Yi Luo Roy.luoyi@huawei.com +86-18665891036 Yingpei Lin linyingpei@huawei.com Jiyong Pang pangjiyong@huawei.com Zhigang Rong zhigang.rong@huawei.com Jian Yu ross.yujian@huawei.com Huawei Ming Gan ming.gan@huawei.com Yuchen Guo guoyuchen@huawei.com Yunsong Yang yangyunsong@huawei.com Junghoon Suh Junghoon.Suh@huawei.com Peter Loc peterloc@iwirelesstech.com 303 Terry Fox, Suite 400 Kanata, Ottawa, Canada F1-17, Huawei Base, Bantian, Shenzhen F1-17, Huawei Base, Bantian, Shenzhen Edward Au edward.ks.au@huawei.com Teyan Chen chenteyan@huawei.com Yunbo Li liyunbo@huawei.com Submission Feng Jiang, Intel Corporation, et. al. Slide 7
doc.: IEEE 802.11-16/1421r0 Authors (continued) Name Affiliation Address Phone Email Jayh Hyunhee Park hyunh.park@lge.com Kiseon Ryu kiseon.ryu@lge.com Jinyoung Chun jiny.chun@lge.com Jinsoo Choi js.choi@lge.com 19, Yangjae-daero 11gil, Seocho-gu, Seoul 137- 130, Korea Jeongki Kim LG Electronics jeongki.kim@lge.com Dongguk Lim dongguk.lim@lge.com Suhwook Kim suhwook.kim@lge.com Eunsung Park esung.park@lge.com HanGyu Cho hg.cho@lge.com Submission Feng Jiang, Intel Corporation, et. al. Slide 8
doc.: IEEE 802.11-16/1421r0 Authors (continued) Name Ron Porat Affiliation Address Phone Email rporat@broadcom.com Sriram Venkateswaran Matthew Fischer Zhou Lan Leo Montreuil Andrew Blanksby Vinko Erceg Thomas Derham Mingyue Ji mfischer@broadcom.com Broadcom #9 Wuxingduan, Xifeng Rd., Xi'an, China Bo Sun sun.bo1@zte.com.cn Kaiying Lv Yonggang Fang Ke Yao Weimin Xing Brian Hart Pooya Monajemi lv.kaiying@zte.com.cn yfang@ztetx.com yao.ke5@zte.com.cn xing.weimin@zte.com.cn brianh@cisco.com pmonajem@cisco.com ZTE 170 W Tasman Dr, San Jose, CA 95134 Cisco Systems Submission Feng Jiang, Intel Corporation, et. al. Slide 9
doc.: IEEE 802.11-16/1421r0 Authors (continued) Name Affiliation Address Innovation Park, Cambridge CB4 0DS (U.K.) Maetan 3-dong; Yongtong-Gu Suwon; South Korea 1301, E. Lookout Dr, Richardson TX 75070 Innovation Park, Cambridge CB4 0DS (U.K.) 1301, E. Lookout Dr, Richardson TX 75070 Maetan 3-dong; Yongtong-Gu Suwon; South Korea Phone Email Fei Tong f.tong@samsung.com +44 1223 434633 hyunjeong.kang@samsung.co m Hyunjeong Kang +82-31-279-9028 Kaushik Josiam k.josiam@samsung.com (972) 761 7437 Samsung Mark Rison m.rison@samsung.com +44 1223 434600 Rakesh Taori rakesh.taori@samsung.com (972) 761 7470 Sanghyun Chang s29.chang@samsung.com +82-10-8864-1751 Yasushi Takatori takatori.yasushi@lab.ntt.co.jp +81 46 859 3135 Yasuhiko Inoue inoue.yasuhiko@lab.ntt.co.jp +81 46 859 5097 Shoko Shinohara Shinohara.shoko@lab.ntt.co.jp +81 46 859 5107 1-1 Hikari-no-oka, Yokosuka, Kanagawa 239-0847 Japan NTT Yusuke Asai asai.yusuke@lab.ntt.co.jp +81 46 859 3494 Koichi Ishihara ishihara.koichi@lab.ntt.co.jp +81 46 859 4233 Junichi Iwatani Iwatani.junichi@lab.ntt.co.jp +81 46 859 4222 Submission Feng Jiang, Intel Corporation, et. al. Slide 10
doc.: IEEE 802.11-16/1421r0 Authors (continued) Name Affiliation Address Phone Email Sigurd Schelstraete Sigurd@quantenna.com Quantenna Huizhao Wang hwang@quantenna.com Narendar Madhavan narendar.madhavan@toshiba.co.jp Masahiro Sekiya Toshihisa Nabetani Tsuguhide Aoki Tomoko Adachi Kentaro Taniguchi Toshiba Daisuke Taki Koji Horisaki David Halls Filippo Tosato Zubeir Bocus Parag Kulkarni Submission Feng Jiang, Intel Corporation, et. al. Slide 11
doc.: IEEE 802.11-16/1421r0 Authors (continued) Name Affiliation Address Phone Email Masahito Mori Masahito.Mori@jp.sony.com Yusuke Tanaka YusukeC.Tanaka@jp.sony.com Yuichi Morioka Sony Corp. Yuichi.Morioka@jp.sony.com Kazuyuki Sakoda Kazuyuki.Sakoda@am.sony.com William Carney William.Carney@am.sony.com Sungeun Lee Saishankar Nandagopalan Stephane Baron Cypress Semiconductor Corporation sungeun.lee@cypress.com snan@cypress.com stephane.baron@crf.canon.fr Pascal Viger Canon pascal.viger@crf.canon.fr Patrice Nezou patrice.nezou@crf.canon.fr Submission Feng Jiang, Intel Corporation, et. al. Slide 12
doc.: IEEE 802.11-16/1421r0 Background 11ax uses 1x/2x HE-LTF to save overhead in preamble When 1x/2x HE-LTF is transmitted, the receiver need to interpolate the channel estimation to obtain the channel response for 4x data tones. In the compressed beamforming feedback, the phase continuity of the beamforming vector across tones may break, which could hurt the interpolation at receiver side and degrade the performance of 1x/2x HE- LTF For 4x HE-LTF, it is desired to maintain the smoothness of the beamforming vector Channel smoothing at receiver provides about 2.5 dB gain However, if beamformed channel is too disruptive for channel smoothing, effective beamforming gain reduces significantly Submission Slide 13 Feng Jiang, Intel Corporation, et. al.
doc.: IEEE 802.11-16/1421r0 Straw poll Do you agree to add the following text in the 11ax spec draft? When 1x/2x/4x HE-LTF is transmitted, it is recommended that the spatial mapping matrix applied to HE-STF and beyond is chosen such that it preserves the smoothness of the physical channel, achieved by limiting the variation of each element s real and imaginary values in the spatial mapping matrix across successive tones within one RU. Yes No Abstain Submission Slide 14 Feng Jiang, Intel Corporation, et. al.
