IEEE 802.11-15/1357r1 Extra Tones in Preamble Study
This document discusses the study conducted on extra tones in the preamble of IEEE 802.11-15/1357r1 standard by a group of authors from Intel, Marvell, Qualcomm, and Broadcom. The study addresses the incorporation of additional tones in the preamble for improved communication protocols. The collaborative effort explores the impact of these extra tones on signal processing and transmission efficiency in wireless networks.
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November, 2015 doc.: IEEE 802.11-15/1357r1 Extra tones in the preamble Date: 2015-11-06 Authors: Name Affiliation Address Phone Email Robert Stacey robert.stacey@intel.com Shahrnaz Azizi shahrnaz.azizi@intel.com Po-Kai Huang po-kai.huang@intel.com Qinghua Li 2111 NE 25th Ave, Hillsboro OR 97124, USA quinghua.li@intel.com Xiaogang Chen +1-503-724-893 xiaogang.c.chen@intel.com Intel Chitto Ghosh chittabrata.ghosh@intel.com Laurent Cariou laurent.cariou@intel.com Yaron Alpert yaron.alpert@intel.com Assaf Gurevitz Ilan Sutskover assaf.gurevitz@intel.com ilan.sutskover@intel.com Submission Slide 1 Intel, Marvell, et. al.
doc.: IEEE 802.11-15/1357r1 Authors (continued) Name Affiliation Address Phone Email Hongyuan Zhang hongyuan@marvell.com Yakun Sun yakunsun@marvell.com Lei Wang Leileiw@marvell.com Liwen Chu liwenchu@marvell.com Jinjing Jiang jinjing@marvell.com Yan Zhang yzhang@marvell.com Rui Cao ruicao@marvell.com 5488 Marvell Lane, Santa Clara, CA, 95054 Sudhir Srinivasa Marvell 408-222-2500 sudhirs@marvell.com Bo Yu boyu@marvell.com Saga Tamhane sagar@marvell.com Mao Yu my@marvel..com Xiayu Zheng xzheng@marvell.com Christian Berger crberger@marvell.com Niranjan Grandhe ngrandhe@marvell.com Hui-Ling Lou hlou@marvell.com Submission Slide 2
doc.: IEEE 802.11-15/1357r1 Authors (continued) Name Affiliation Address Phone Email 5775 Morehouse Dr. San Diego, CA, USA Straatweg 66-S Breukelen, 3621 BR Netherlands 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 1700 Technology Drive San Jose, CA 95110, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA Straatweg 66-S Breukelen, 3621 BR Netherlands 2100 Lakeside Boulevard Suite 475, Richardson TX 75082, USA 1060 Rincon Circle San Jose CA 95131, USA Straatweg 66-S Breukelen, 3621 BR Netherlands Alice Chen alicel@qti.qualcomm.com Albert Van Zelst allert@qti.qualcomm.com Alfred Asterjadhi aasterja@qti.qualcomm.com Arjun Bharadwaj arjunb@qti.qualcomm.com Bin Tian btian@qti.qualcomm.com Carlos Aldana caldana@qca.qualcomm.com George Cherian gcherian@qti.qualcomm.com Qualcomm Gwendolyn Barriac gbarriac@qti.qualcomm.com Hemanth Sampath hsampath@qti.qualcomm.com Lin Yang linyang@qti.qualcomm.com Menzo Wentink mwentink@qti.qualcomm.com Naveen Kakani nkakani@qti.qualcomm.com Raja Banerjea rajab@qit.qualcomm.com Richard Van Nee rvannee@qti.qualcomm.com Submission Slide 3
doc.: IEEE 802.11-15/1357r1 Authors (continued) Name Affiliation Address Phone Email 1700 Technology Drive San Jose, CA 95110, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 5775 Morehouse Dr. San Diego, CA, USA 1700 Technology Drive San Jose, CA 95110, USA 1700 Technology Drive San Jose, CA 95110, USA 1700 Technology Drive San Jose, CA 95110, USA Rolf De Vegt rolfv@qca.qualcomm.com Sameer Vermani svverman@qti.qualcomm.com Simone Merlin smerlin@qti.qualcomm.com Tao Tian Qualcomm ttian@qti.qualcomm.com Tevfik Yucek tyucek@qca.qualcomm.com VK Jones vkjones@qca.qualcomm.com Youhan Kim youhank@qca.qualcomm.com Ron Porat rporat@broadcom.com Sriram Venkateswaran mfischer@broadcom.com Matthew Fischer Leo Montreuil Andrew Blanksby Vinko Erceg Broadcom Submission Slide 4
doc.: IEEE 802.11-15/1357r1 Authors (continued) Name Affiliation Address Phone Email No. 1 Dusing 1st Road, Hsinchu, Taiwan James Yee +886-3-567-0766 james.yee@mediatek.com Alan Jauh alan.jauh@mediatek.com chinghwa.yu@mediatek.co m frank.hsu@mediatek.com Mediatek Chingwa Hu Frank Hsu 2860 Junction Ave, San Jose, CA 95134, USA Thomas Pare +1-408-526-1899 thomas.pare@mediatek.com chaochun.wang@mediatek.c om james.wang@mediatek.com ChaoChun Wang James Wang Mediatek USA Jianhan Liu Jianhan.Liu@mediatek.com Tianyu Wu tianyu.wu@mediatek.com Zhou Lan Zhou.lan@mediaTek.com russell.huang@mediatek.co m Russell Huang Joonsuk Kim joonsuk@apple.com mujtaba@apple.com Aon Mujtaba Guoqing Li Apple guoqing_li@apple.com Eric Wong ericwong@apple.com Chris Hartman chartman@apple.com Submission Slide 5
doc.: IEEE 802.11-15/1357r1 Authors (continued) Name Affiliation Address Phone Email Peter Loc peterloc@iwirelesstech.com F1-17, Huawei Base, Bantian, Shenzhen 5B-N8, No.2222 Xinjinqiao Road, Pudong, Shanghai F1-17, Huawei Base, Bantian, Shenzhen 5B-N8, No.2222 Xinjinqiao Road, Pudong, Shanghai 5B-N8, No.2222 Xinjinqiao Road, Pudong, Shanghai 10180 Telesis Court, Suite 365, San Diego, CA 92121 NA 303 Terry Fox, Suite 400 Kanata, Ottawa, Canada F1-17, Huawei Base, Bantian, Shenzhen 10180 Telesis Court, Suite 365, San Diego, CA 92121 NA 303 Terry Fox, Suite 400 Kanata, Ottawa, Canada 5B-N8, No.2222 Xinjinqiao Road, Pudong, Shanghai 303 Terry Fox, Suite 400 Kanata, Ottawa, Canada F1-17, Huawei Base, Bantian, Shenzhen F1-17, Huawei Base, Bantian, Shenzhen Le Liu liule@huawei.com +86-18601656691 Jun Luo jun.l@huawei.com Yi Luo Roy.luoyi@huawei.com +86-18665891036 Yingpei Lin linyingpei@huawei.com Jiyong Pang pangjiyong@huawei.com Zhigang Rong zhigang.rong@huawei.com Rob Sun Rob.Sun@huawei.com Huawei David X. Yang david.yangxun@huawei.com Yunsong Yang yangyunsong@huawei.com Junghoon Suh Junghoon.Suh@huawei.com Jiayin Zhang zhangjiayin@huawei.com +86-18601656691 Edward Au edward.ks.au@huawei.com Teyan Chen chenteyan@huawei.com Yunbo Li liyunbo@huawei.com Submission Slide 6
doc.: IEEE 802.11-15/1357r1 Authors (continued) Name Affiliation Address Phone Email Jinmin Kim Jinmin1230.kim@lge.com Kiseon Ryu kiseon.ryu@lge.com Jinyoung Chun jiny.chun@lge.com Jinsoo Choi js.choi@lge.com 19, Yangjae-daero 11gil, Seocho-gu, Seoul 137- 130, Korea Jeongki Kim jeongki.kim@lge.com LG Electronics Dongguk Lim dongguk.lim@lge.com Suhwook Kim suhwook.kim@lge.com Eunsung Park esung.park@lge.com JayH Park Hyunh.park@lge.com HanGyu Cho hg.cho@lge.com Thomas Derham Orange thomas.derham@orange.com #9 Wuxingduan, Xifeng Rd., Xi'an, China Bo Sun sun.bo1@zte.com.cn Kaiying Lv Yonggang Fang Ke Yao Weimin Xing Brian Hart Pooya Monajemi lv.kaiying@zte.com.cn yfang@ztetx.com yao.ke5@zte.com.cn xing.weimin@zte.com.cn brianh@cisco.com pmonajem@cisco.com ZTE 170 W Tasman Dr, San Jose, CA 95134 Cisco Systems Submission Slide 7
doc.: IEEE 802.11-15/1357r1 Authors (continued) Name Affiliation Address Innovation Park, Cambridge CB4 0DS (U.K.) Maetan 3-dong; Yongtong-Gu Suwon; South Korea 1301, E. Lookout Dr, Richardson TX 75070 Innovation Park, Cambridge CB4 0DS (U.K.) 1301, E. Lookout Dr, Richardson TX 75070 Maetan 3-dong; Yongtong-Gu Suwon; South Korea Phone Email Fei Tong f.tong@samsung.com +44 1223 434633 Hyunjeong Kang hyunjeong.kang@samsung.com +82-31-279-9028 Kaushik Josiam k.josiam@samsung.com (972) 761 7437 Samsung Mark Rison m.rison@samsung.com +44 1223 434600 Rakesh Taori rakesh.taori@samsung.com (972) 761 7470 Sanghyun Chang s29.chang@samsung.com +82-10-8864-1751 Yasushi Takatori takatori.yasushi@lab.ntt.co.jp Yasuhiko Inoue inoue.yasuhiko@lab.ntt.co.jp Shoko Shinohara Shinohara.shoko@lab.ntt.co.jp 1-1 Hikari-no-oka, Yokosuka, Kanagawa 239-0847 Japan NTT Yusuke Asai asai.yusuke@lab.ntt.co.jp Koichi Ishihara ishihara.koichi@lab.ntt.co.jp Junichi Iwatani Iwatani.junichi@lab.ntt.co.jp 3-6, Hikarinooka, Yokosuka- shi, Kanagawa, 239-8536, Japan Akira Yamada yamadaakira@nttdocomo.com watanabe@docomoinnovations. com hpapadopoulos@docomoinnova tions.com Fujio Watanabe NTT DOCOMO 3240 Hillview Ave, Palo Alto, CA 94304 Haralabos Papadopoulos Submission Slide 8
doc.: IEEE 802.11-15/1357r1 Authors (continued) Name Affiliation Address Phone Email Masahito Mori Masahito.Mori@jp.sony.com Yusuke Tanaka YusukeC.Tanaka@jp.sony.com Yuichi Morioka Sony Corp. Yuichi.Morioka@jp.sony.com Kazuyuki Sakoda Kazuyuki.Sakoda@am.sony.com William Carney William.Carney@am.sony.com Submission Slide 9
November, 2015 doc.: IEEE 802.11-15/1357r1 Outline To increase data subcarriers in SIG-A/SIG-B, we propose to allocate 4 extra subcarriers to 1x portion of the HE preamble not including L-STF and L-LTF fields. With extra tones, there are some power imbalance issues need to be discussed. Submission Intel, Marvell, et. al. Slide 9
November, 2015 doc.: IEEE 802.11-15/1357r1 Motivation for extra subcarriers in the HE preamble Due to the limitation that L-LTF covers only 52 subcarriers, HE- SIG-A/HE-SIG-B can only transmit information on 48 subcarriers. More payloads were added in HE-SIG-A for 11ax HE-SIG-B may need to convey large amount of information depending on the number of scheduled STAs Propose to add training subcarriers in L-SIG This extension provides extra channel estimates for the subsequent symbols (HE-SIGA/HE-SIGB) Symbols that follow L-SIG will have a subcarrier allocation similar to 11n/ac Submission Slide 11 Intel, Marvell, et. al.
November, 2015 doc.: IEEE 802.11-15/1357r1 Increased Subcarrier Allocation in L-SIG Allocate additional subcarriers in L-SIG They are extended L-LTF subcarriers used for channel estimation; Allows more data bits in HE-SIG-A and HE-SIG-B than that of the L- SIG The repeated extra subcarriers in RL-SIG allow comparable SNR performance as L-LTF L-STF L-LTF L-SIG R-L-SIG HE-SIGA1 HE-SIGA2 HE-SIGB Submission Slide 12 Intel, Marvell, et. al.
November, 2015 doc.: IEEE 802.11-15/1357r1 Impacts to legacy/11ax devices For legacy devices: The extension would not impact the performance of legacy devices in decoding L-SIG; The extended subcarriers are simply disregarded by the legacy devices. For 11ax devices: Aware of the additional subcarriers and use them for channel estimation; Decoding L-SIG similar to legacy devices. Submission Slide 13 Intel, Marvell, et. al.
November, 2015 doc.: IEEE 802.11-15/1357r1 Power Adjustment We propose to transmit L-SIG, RL-SIG, HE-SIG-A and HE-SIG-B with the same total power as L-LTF field We could scale the power on L-SIG and RL-SIG to maintain the same power per tone as in L-LTF. But keeping the same power per OFDM symbol is more straightforward. By keeping the same power per symbol in L-SIG/RL-SIG and L-LTF, the estimated channel on L-LTF and those obtained from extra subcarriers of L-SIG/RL-SIG have slightly power imbalance. Friendly to amplitude immunity modulation (BPSK/QPSK); If 16QAM/64QAM is applied in SIGB, receiver may choose to de- boost the CE with factor sqrt(52/56) on the tones spanned by L-LTF. Submission Slide 14 Intel, Marvell, et. al.
November, 2015 doc.: IEEE 802.11-15/1357r1 Summary To increase HE-SIG-A/HE-SIG-B payload, propose to add 4 extra subcarriers on L-SIG and RL-SIG for additional LTF training. Add 4 extra tones starting from L-SIG, through R-LSIG, HE-SIG-A and HE-SIG-B fields. Propose to transmit L-SIG, RL-SIG, HE-SIG-A and HE- SIG-B with the same total power as L-LTF field. Receiver adjusts the power of estimated channel accordingly if higher modulation order (>QPSK) is used on HE-SIG-B. Submission Slide 15 Intel, Marvell, et. al.
November, 2015 doc.: IEEE 802.11-15/1357r1 Straw poll Do you support to: Allocate 4 extra subcarriers, two at each edge of each 20MHz sub- channel, for L-SIG, RL-SIG, HE-SIG-A and HE-SIG-B fields in 11ax PPDUs. The 4 subcarriers added to the L-SIG and RL-SIG fields are transmitted with known TBD BPSK constellations (+-1). The number of data subcarriers in HE-SIG-A and HE-SIG-B fields are increased by 4 in each 20MHz sub-channel. L-SIG, RL-SIG, HE-SIG-A and HE-SIG-B fields are always transmitted with the same total power as L-LTF field (in cases when L-LTF is not being boosted). Submission Slide 16 Intel, Marvell, et. al.
