Cutting-Edge Fiber to Chip Packaging for Quantum Applications
Cutting-edge research on fiber to chip packaging for quantum applications, showcasing low-loss techniques and advanced photonics devices. The study covers topics such as packaging multiple fibers, fabrication processes, fiber array fusion splicing, and transmission curves for multiple fibers. This work represents a significant advancement in the field of photonic packaging, enabling improved performance and reliability for quantum technologies.
Download Presentation
Please find below an Image/Link to download the presentation.
The content on the website is provided AS IS for your information and personal use only. It may not be sold, licensed, or shared on other websites without obtaining consent from the author. Download presentation by click this link. If you encounter any issues during the download, it is possible that the publisher has removed the file from their server.
E N D
Presentation Transcript
Fiber to chip packaging with low loss for Fiber to chip packaging with low loss for quantum applications quantum applications Juniyali Nauriyal , Meiting Song , Marissa Granados-Baez, Yi Zhang, Jaime Cardenas
Packaging multiple fibers at once Optical Transceiver Cost of a Photonic Device 20% 80% https://opticalconnectionsnews.com/2019/01/rockley-announces-silicon-photonics- platform-for-advanced-sensing-applications-and-interconnectivity-for-ai/ Packaging Fabrication
Fiber array fusion splicing Photonic chip Fiber array Nitride tapers Mode converter Photonic chip Fusion Spot from laser 250 m 125 m 4-fiber array U-grooves TOP VIEW Juniyali Nauriyal, Meiting Song, Raymond Yu, and Jaime Cardenas, "Fiber-to-chip fusion splicing for low-loss photonic packaging," Optica 6, 549-552 (2019)
