Advanced Copper Treatments for High-Frequency Applications

Introducing the N9000 series of copper materials featuring zinc-free treatments for improved thermal resistance, high bond strength, and increased treatment density. These treatments maintain structure at high temperatures, enhancing integrity and reducing PIM. The N9000 R Copper and N9000 S Copper offer specific properties for different applications, such as high-temperature elongation and ultra-flat foil with fast etching behavior. Explore the typical properties and profiles of these advanced copper solutions designed for various laminates and impedance boards.

• Copper Treatments
• High-Frequency Applications
• N9000 Series
• Advanced Materials
• Zinc-Free
• Thermal Resistance

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1. N9000 Materials Coppers July 2016

2. N9000 Coppers New generation of high frequency zinc-free treatments Improved thermal resistance High bond strength on proprietary resin systems Higher treatment density drastically increasing the active surface No change of structure at high temperature Very significant contribution for improved integrity and PIM Thickness from 12 to 70 m C R S N

3. N9000 Coppers - Profile comparison Higher Rz of treated side C R S Lower Rz of treated side N

4. N9000 R Copper Drum side treated with very low profile High temperature elongation properties Zinc-free treatment for superior PIM Organic free, anti-tarnish passivation Designed for PTFE based laminates Availability & Designation: RH 18 m R1 35 m R2 70 m

5. N9000 R Copper Typical Properties Copper R Copper Measured Parameters Units Product Gauge 18 1/2 35 1 70 2 m oz. Nominal Thickness 154 0.50 283 0.93 576 1.89 g/m oz/ft Area weight ( 5%) 6.0 236 9.0 354 10.0 394 m .inch Untreated Side Roughness (Rz) 0.9 35.4 1.2 47.2 m .inch Untreated Side Roughness (Rq) - 5.1 201 m .inch Treated Side Roughness (Rz) 1.1 43 m .inch Treated Side Roughness (Rq) 276 40 MPa k.Lb/in Tensile Strength Transverse (RT) 138 20 MPa k.Lb/in Tensile Strength Transverse (180 C) Elongation Transverse (RT) 6 9 15 % Elongation Transverse (180 C) 3 % 16.3 Peel Strength after Thermal Stress * (20s /285 C) Lbs/in 10 GHz -0.0463 20GHz -0.1046 30GHz -0.1659 40GHz -0.2617 Insertion Loss * dB/cm Solderability Complies with IPC-4562A specifications - * Tested on NX9255 material with 35 m copper

6. N9000 S Copper Ultra flat ED copper foil extreme fine grain structure High temperature elongation properties Zinc-free treatment for superior PIM Fast and precise etching behaviour Organic-free, anti-tarnish passivation Designed for ultra thin laminates or high speed controlled impedance boards Availability & Designation: SH 18 m S1 35 m

7. N9000 S Copper Typical Properties Copper S Copper Measured Parameters Units Product Gauge 18 1/2 35 1 m oz. Nominal Thickness 156 0.51 285 0.93 g/m oz/ft Area weight ( 5%) < 0.35 < 14 m .inch Untreated Side Roughness (Ra) 0.3 11.8 m .inch Untreated Side Roughness (Rq) 2.0 3.0 79 118 m .inch Treated Side Roughness (Rz) 0.5 19.7 m .inch Treated Side Roughness (Rq) > 207 > 30 > 276 > 40 MPa k.Lb/in Tensile Strength Transverse (RT) > 103 > 15 > 138 > 20 MPa k.Lb/in Tensile Strength Transverse (180 C) Elongation Transverse (RT) 8 - 30 % Elongation Transverse (180 C) 10 - 30 % 14.5 Peel Strength after Thermal Stress * (20s /285 C) Lbs/in 10GHz -0.0483 20GHz -0.0896 30GHz -0.1487 40GHz -0.2359 Insertion Loss * dB/cm Solderability Complies with IPC-4562A specifications - * Tested on NX9255 material with 35 m copper

8. N9000 N Copper Ultra flat ED copper foil extreme fine grain structure No profile zinc-free and arsenic free treatment Ultra-flat profile for minimalist skin effect Superior conductor losses and PIM performance High temperature elongation properties Organic-free, anti-tarnish passivation Availability & Designation: NH 18 m N1 35 m

9. N9000 N Copper Typical Properties Copper N Copper Measured Parameters Units Product Gauge 18 1/2 35 1 m oz. Nominal Thickness 150 0.49 283 0.93 g/m oz/ft Area weight ( 5%) < 0.35 < 14 m .inch Untreated Side Roughness (Ra) 0.3 11.8 m .inch Untreated Side Roughness (Rq) 1.3 52 m .inch Treated Side Roughness (Rz) 0.3 11.8 m .inch Treated Side Roughness (Rq) > 207 > 30 > 276 > 40 MPa k.Lb/in Tensile Strength Transverse (RT) > 103 > 15 > 138 > 20 MPa k.Lb/in Tensile Strength Transverse (180 C) Elongation Transverse (RT) 8 - 30 % Elongation Transverse (180 C) 10 - 30 % 11.8 Peel Strength after Thermal Stress * (20s /285 C) Lbs/in 10GHz -0.0433 20GHz -0.0818 30GHz -0.1285 40GHz -0.2094 Insertion Loss * dB/cm Solderability Complies with IPC-4562A specifications - * Tested on NX9255 material with 35 m copper

10. N9000 C Copper (Old and still running applications only) Matte side treated High temperature elongation properties Zinc-free treatment Organic free, anti-tarnish passivation Designed for PTFE based laminates Availability & Designation: CT 12 m CH 18 m C1 35 m C2 70 m

11. N9000 C Copper Typical Properties Copper C Copper Measured Parameters Units Product Gauge 12 1/3 18 1/2 35 1 70 2 m oz. Nominal Thickness 106.8 0.35 154 0.50 283 0.93 586 1.92 g/m oz/ft Area weight ( 5%) 0.20 0.40 8 16 m .inch Untreated Side Roughness (Ra) < 0.6 < 25 m .inch Untreated Side Roughness (Rq) 5.1 201 5.1 201 5.5 217 6.6 260 m .inch Treated Side Roughness (Rz) 0.9 35 0.9 35 1.0 39 1.2 47 m .inch Treated Side Roughness (Rq) > 276 > 40 MPa k.Lb/in Tensile Strength Transverse (RT) > 138 > 20 MPa k.Lb/in Tensile Strength Transverse (180 C) Elongation Transverse (RT) 3 6 6 9 % Elongation Transverse (180 C) 2 3 3 3 % Solderability Complies with IPC-4562A specifications -