Understanding Electromigration Effects in IC Interconnect Lines
Background: As IC circuits advance, preventing failures like electromigration is crucial. Vacancies lead to potential failures in metal interconnects by causing macroscopic voids and hillocks. Explore the governing equations and physics interfaces behind the migration of vacancies in IC circuits. Im
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Understanding CMOS Electrical Characteristics for INEL4207
This document delves into the electrical characteristics of CMOS technology, covering topics such as power-delay product, latch-up, hot carriers, electromigration, sheet resistance, and parasitic capacitance. It provides valuable insights into the performance and behavior of CMOS circuits.
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